COLLEGE HOUSE ENTERPRISES, LLC
|
COLLEGE HOUSE ENTERPRISES, LLC
|
|
|
EXPERIMENTAL STRESS ANALYSIS, 4th Edition James W. Dally and William F. Riley
In the 4th edition, the essential features contained in the 3rd edition of Experimental Stress Analysis have been retained; however, extensive revisions have been incorporated, which reflects many of the changes in experimental mechanics that have occurred during the past 12 years. A significant amount of new content has been added by expanding existing chapters and by introducing several new chapters. Some material covering outdated methods have been removed. The text is intended for upper-division undergraduate students or graduate students beginning to study experimental methods.
The organization of the textbook includes five parts, which are briefly
described below:
Part
I: Elementary Elasticity and Fracture Mechanics contains three chapters
on elasticity and an introductory chapter on elementary fracture mechanics.
A section has been added to Chapter 2 to provide the stress-strain
relations for composite materials.
Part II: Instrumentation for Engineering Measurements contains four chapters and represents mostly new content. Chapter 5 provides introductory descriptions of 12 different types of sensors that are used in measuring mechanical quantities. Chapter 6 describes signal conditioning circuits used in conjunction with these sensors in making engineering measurements. Chapter 7 deals with analog and digital signals describing methods of conversion and several methods used to record digital signals. Finally Chapter 8 provides an introduction to LabVIEW, a popular graphic language program, used to record and analyze data and to control production processes.
Part III: Strain-Measurement Methods contains four chapters. The content is similar to that found in the 3rd edition although some material has been eliminated and other information has been reorganized. Chapter 9 provides an introduction describing general methods of strain measurement. Electrical resistance strain gages are covered in considerable detail in Chapter 10. Strain-gage circuits and parameters affecting their performance are covered in Chapter 11. Chapter 12 describes analysis methods and illustrates techniques for determining principal stresses from rosettes. The chapter also describes torque and stress gages, and covers techniques for measuring stress intensity factors, crack initiation toughness and residual stresses.
Part IV: Optical-Methods of Stress Analysis, which has been expanded to reflect many of the advances in the past decade, includes eight chapters. Chapter 13 covers basic optics that serves as a foundation for subsequent chapters. The coverage of photoelasticity has been reduced to two chapters. Chapter 14 provides the theoretical basis for the method. New content added to this chapter includes RGB photoelasticity and the grey field polariscope. Chapter 15 provides practical information on the application of photoelasticity including two- and three-dimensional methods and birefringent coatings. Chapter 16 introduces interferometric methods which serve as a basis for describing techniques used in the holographic interferometer. Chapter 17 covers both classical moiré methods and the more modern procedures of moiré interferometry. The moiré chapter has been expanded to include advanced applications of moiré interferometry and e-beam moiré. Chapter 18, which is new, describes speckle methods including speckle interferometry and electronic speckle pattern interferometry. Chapter 19, which is also new, deals with digital image correlation methods. Chapter 20 covers methods for determining fracture parameters extends the textbook’s coverage to include fracture analysis.
Part
V: Statistical Analysis of
Experimental Data contains a single chapter.
Chapter 21 deals with the application of statistics in enhancing
experimental accuracy and in improving the method of reporting experimental
results that show variation. Each
part of the book is essentially independent so that instructors can be quite
flexible in selecting course content. For
instance, a two- or three-credit course on strain gages can be offered by using
three chapters of Part I and all of Part III.
Parts I and IV can be combined to provide a thorough three- or
four-credit course on optical methods of experimental analysis.
Selected chapters from the first four parts can be organized to introduce
the broader field of experimental stress analysis.
Chapters selected from Part II and Part III can be combined to teach an
experimental measurements course. A
complete detailed treatment of the subject matter covered in the text and
supplemented with laboratory exercises on strain gages, photoelasticity, moiré
interferometry, speckle methods and digital image correlation will require six-
to eight-credit hours.
The
essential feature of the text is its completeness in introducing the entire
range of experimental methods to the student.
A reasonably deep coverage is presented of the theory required to
understand experimental stress analysis and of the five primary methods
employed: strain gages, photoelasticity, moiré, interferometry (including
holography and speckle) and digital image correlation.
While primary emphasis is placed on the theory of experimental stress
analysis, the important experimental techniques associated with each of the four
major methods are covered in sufficient detail to permit the student to begin
laboratory work with a clear understanding of experimental procedures.
Exercises designed to support and extend the treatment and to show the
application of the theory have been placed at the end of all of the chapters.
Laboratory
exercises have not been included, because laboratory work will depend strongly
on local conditions such as the equipment and supplies available, the
instructor’s interests, the number of students in the class and research
activities of current interest. It
is believed that the instructor is best qualified to specify the associated
laboratory exercises on the basis of interest, equipment, supplies, and time
available for this important supplement to the course.
A
significant amount of new material has been added to this fourth edition;
however, space limitations did not permit coverage of the more modern research
topic such as nano-mechanics, bio-mechanics, smart structures, MEMs, etc.
It is anticipated that the instructor will, in certain instances, treat
these topics by using his or her lecture notes or by using recent papers
published in the technical journals. The
authors hope that most instructors will find the fundamental material required
to present a complete and practical course on the theory of experimental stress
analysis in this text.
The
material presented here has been assembled by both authors over a period of 50
years. Courses have been developed
on Experimental Stress Analysis, Photoelasticity, and Photomechanics at Illinois
Institute of Technology,
The fourth edition is now available. Contact us to order your copy. The third edition will be available until our inventory is depleted.
EXPERIMENTAL STRESS ANALYSIS, 4th Edition by James W. Dally and William F. Riley ISBN 0-9762413-0-7 Hardback 688 pages List Price $96.00 EXPERIMENTAL STRESS ANALYSIS, 3rd Edition by James W. Dally and William F. Riley ISBN 0-9700675-8-5 Paperback 639 pages List Price 74.95 To Order:
By mail at:
College House Enterprises, LLC 5713 Glen Cove Dr. Knoxville, TN 37919-8611
By phone or Fax at: (865) 947 6174 (9:00 am to 5:00 pm ET)
By e mail at:
Sorry, we do not accept credit or debit cards. If you would like to place an order, please provide your name, address, phone number and the number of copies you are ordering. Orders for a single copy are shipped by Priority Mail at a cost of $9.00. We will ship your order with an invoice requesting payment by check for the books delivered plus the shipping charge. We will also accept payment from PayPal with email transfer.
|
|
|
